Titre du document / Document title

A model of pad-abrasive interactions in chemical mechanical polishing

Auteur(s) / Author(s)

PAUL Ed ; HORN John ; YING LI ; BABU S. V. ;

Résumé / Abstract

In model descriptions of CMP, slurry abrasives stick to and release from the polishing pad. This model extension predicts how pad-abrasive interactions depend on abrasive size. The prediction is compared to five sets of experimental data for systems using silica or alumina abrasives and different pads to polish copper, tungsten, or tantalum under various experimental conditions. The finding that larger particles are harder to dislodge from the pad than smaller ones holds over two orders of magnitude in abrasive diameter. This affects material removal rates which depend on the number of abrasive particles attached to the pad.

Revue / Journal Title

Electrochemical and solid-state letters    ISSN  1099-0062 

Source / Source

2007, vol. 10, n^o4, [Note(s): H131-H133]

Langue / Language

Anglais

Editeur / Publisher

Institute of Electrical and Electronics Engineers, Pennington, NJ, ETATS-UNIS  (1998) (Revue)

Localisation / Location

INIST-CNRS, Cote INIST : 26649, 35400014692991.0290