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Titre du document / Document title

Defect-free wet etching through pyrex glass using Cr/Au mask

Auteur(s) / Author(s)

TAY Francis E. H. (1 2) ; ILIESCU Ciprian (2) ; JI JING (1) ; JIANMIN MIAO (3) ;

Affiliation(s) du ou des auteurs / Author(s) Affiliation(s)

(1) Department of Mechanical Engineering, National University of Singapore, 10 Kent Ridge Crescent, 119260 Singapore, SINGAPOUR
(2) Institute of Bioengineering and Nanotechnology, 31 Biopolis Way, The Nanos, #04-01, 138669 Singapore, SINGAPOUR
(3) Micromachines Center, School of Mechanical and Production Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798 Singapore, SINGAPOUR

Résumé / Abstract

This paper reports the highest etch depth of annealed Pyrex glass achieved by wet etching in highly concentrated HF solution, using a low stress chromium-gold with assistance of photoresist as masking layer. The strategies to achieve that are: increasing the etch rate of glass and simultaneously increasing the resistance of Cr/ Au mask in the etchant. By annealing the Pyrex glass and using a highly concentrated HF acid, a high etch rate can be obtained. Furthermore, a method to achieve a good resistance of the Cr/Au masking layer in the etching solution is to control the residual stress and to increase the thickness of Au deposition up to 1 μm. In addition, the presence of a hard baked photoresist can improve the etching performance. As a result, a 500-μm thick Pyrex glass wafer was etched through.

Revue / Journal Title

Microsystem technologies    ISSN  0946-7076 

Source / Source

Congrès
DTIP Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Montreux , SUISSE (01/06/2005)
2006, vol. 12, no 10-11 (193 p.)  [Document : 5 p.] (17 ref.), [Notes: Selected papers], pp. 935-939 [5 page(s) (article)]

Langue / Language

Anglais

Editeur / Publisher

Springer, Heidelberg, ALLEMAGNE  (1994) (Revue)

Mots-clés anglais / English Keywords

Heat treatment

;

Annealing

;

Etching rate

;

Photoresist

;

Gold

;

Chromium

;

Penetration depth

;

Heat resistant glass

;

Chemical etching

;

Defect

;

Mots-clés français / French Keywords

Traitement thermique

;

Recuit

;

Vitesse gravure

;

Photorésist

;

Or

;

Chrome

;

Profondeur pénétration

;

Verre pyrex

;

Attaque chimique

;

Défaut

;

Mots-clés espagnols / Spanish Keywords

Tratamiento térmico

;

Recocido

;

Velocidad grabado

;

Fotorresistencia

;

Oro

;

Cromo

;

Profundidad penetración

;

Vidrio pyrex

;

Ataque químico

;

Defecto

;

Localisation / Location

INIST-CNRS, Cote INIST : 26257, 35400014219548.0070

Nº notice refdoc (ud4) : 18110699



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