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Titre du document / Document title

High temperature automotive electronics

Auteur(s) / Author(s)

JOHNSON R. Wayne (1) ; EVANS John L. (1) ; JACOBSEN Peter (2) ; THOMPSON Rick (3) ;

Affiliation(s) du ou des auteurs / Author(s) Affiliation(s)

(1) Center for Advanced Vehicle Electronics, Auburn University, 162 Broun Hall/ECE Dept., Auburn, AL 36849, ETATS-UNIS
(2) Eaton Corporation, Innovation Center, 26201 Northwestern Hwy., P.O. Box 766, Southfield, MI 48037, ETATS-UNIS
(3) DaimlerChrysler Corporation, Huntsville Electronics, 100 Electronics Blvd., Huntsville, AL 35824-7701, ETATS-UNIS

Résumé / Abstract

According to the Freedonia group, OEM demand for automotive electronics is predicted to grow from $20.5B in 1999 to $37B in 2009 corresponding to an increase in electronics per vehicle of $1,208 in 1999 to $1,864 in 2009. New or enhanced automotive systems include intelligent airbags, adaptive cruise control, steer-by-wire, brake-by-wire, electronic stability control, telematics, and passenger entertainment systems. To meet the higher vehicle power requirements for these and other systems the industry is moving to a 42V system. A 42V system will also enable combined starter/alternators and electronic valves. With the switch from hydraulic or mechanical to electronic actuation, distributed control systems with smart actuators are being developed. Placing the electronics at the point of use often exposes the electronics to temperatures well above the conventional 125°C limit. Under-hood temperatures are approaching 140°C, on-engine and in-transmission temperatures are 150-175°C and wheel mounded temperatures are 250°C. This paper will examine the system level motivation for distributed systems and the resulting temperature requirements. The temperature limitations of semiconductor and passive components, and packaging and interconnection technology will then be discussed. An in-transmission control module developed for 150-165°C use will be discussed in detail to identify the unique challenges of high temperature electronics.

Revue / Journal Title

SPIE proceedings series  

Source / Source

Congrès
2002 international conference on advanced packaging and systems :   ( Reno NV, 10-13 March 2002 )
ICAPS : international conference on advanced packaging and systems, Reno NV , ETATS-UNIS (10/03/2002)
2002  , vol. 4828, pp. 69-79[Note(s) :  [274 p.]] (29 ref.) ISBN 0-930815-65-3 ;  Illustration : Illustration ;

Langue / Language

Anglais

Editeur / Publisher

Society of Photo-Optical Instrumentation Engineers, Bellingham, WA, INTERNATIONAL  (1988) (Revue)
IMAPS, Washington, ETATS-UNIS  (2002) (Monographie)

Mots-clés anglais / English Keywords

Integrated circuit bonding

;

Interconnection

;

Electronic packaging

;

Distributed control

;

Adaptive control

;

Intelligent system

;

Automotive electronics

;

Mots-clés français / French Keywords

Assemblage circuit intégré

;

Interconnexion

;

Packaging électronique

;

Commande répartie

;

Commande adaptative

;

Système intelligent

;

Electronique automobile

;

Mots-clés espagnols / Spanish Keywords

Interconexión

;

Packaging electrónico

;

Control repartido

;

Control adaptativo

;

Sistema inteligente

;

Electrónica automóvil

;

Localisation / Location

INIST-CNRS, Cote INIST : 21760, 35400010841485.0150

Nº notice refdoc (ud4) : 14181030



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